Factorial

Thermal & Mechanical Design Engineer – Accelerator Boards

Factorial

full-time

Posted on:

Location Type: Hybrid

Location: Karlsruhe • 🇩🇪 Germany

Visit company website
✨ AI Apply
Apply

Job Level

Mid-LevelSenior

Tech Stack

AirflowPython

About the role

  • We are seeking a Thermal & Mechanical Design Engineer to support the development of next-generation accelerator boards used in data center servers for HPC and AI/ML workloads.
  • You will work closely with our senior thermal/mechanical architect to design, analyze, and validate cooling solutions and mechanical structures for high-power PCIe and custom form-factor accelerator cards.
  • Collaborate with the senior thermal/mechanical architect on thermal design of accelerator PCBs and assemblies, including: Heat sink and cold plate design, Air and liquid cooling solutions, Thermal interface materials (TIMs) and heat spreaders.
  • Support CFD-based thermal simulations and analysis for high-power GPUs/accelerators, VRMs, and memory subsystems at the board and system level.
  • Assist in mechanical design and packaging: 3D CAD models for heatsinks, liquid cold plates, coolant circuits, brackets, backplates, and retention mechanisms.
  • Compliance with server/PCIe mechanical constraints and standards.
  • Help define and execute thermal validation tests: Sensor placement and logging, Chamber tests, fan speed and airflow characterization, Correlation of test results to simulation models.
  • Generate and maintain mechanical drawings, BOMs, and documentation in accordance with internal processes and data center standards.
  • Work cross-functionally with PCB, SI/PI, power, and system teams to ensure thermal and mechanical requirements are incorporated early in the design.

Requirements

  • Master’s degree in Mechanical Engineering, Aerospace Engineering, or related field.
  • 5+ years of relevant experience in thermal and/or mechanical design (internships and project experience acceptable).
  • Basic understanding of: Heat transfer and fluid dynamics (conduction, convection, radiation)
  • Mechanical design principles and tolerance/stack-up
  • Experience with 3D CAD tools (e.g., Creo, SolidWorks, NX, or similar).
  • Exposure to thermal simulation tools (e.g., FloTHERM, Icepak, 6SigmaET, Creo Flow Analysis, or similar), even at university or project level.
  • Strong problem-solving skills, attention to detail, and willingness to learn in a fast-paced environment.
  • Experience involving electronics cooling or data center/server hardware.
  • Familiarity with industry standards such as PCIe card form factors, 19" rack systems, or OCP server designs.
  • Hands-on lab experience with thermal measurement (thermocouples, IR cameras, etc.).
  • Basic scripting skills (Python/Matlab) for data processing and report generation.
Benefits
  • A chance to work on one of the most transformative AI and silicon engineering companies in Europe with cutting-edge technology and industry leaders.
  • We offer a remuneration package that values your experience.
  • We believe in investing in our employees and providing them with opportunities for growth and career development.
  • Work in a hybrid environment with flexible scheduling.
  • Join an innovative team and experience company growth.
  • Opportunity to travel to other countries in Europe to meet the teams, collaborate and drive solutions.

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard skills
thermal designmechanical designheat transferfluid dynamics3D CADthermal simulationscriptingthermal measurementBOM generationvalidation testing
Soft skills
problem-solvingattention to detailwillingness to learncollaborationcross-functional teamwork
Certifications
Master’s degree in Mechanical EngineeringMaster’s degree in Aerospace Engineering