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Eightfold

Package Architect – Advanced Packaging, System Exploration

Eightfold

. Define and explore advanced package architectures for future memory systems .

Posted 4/21/2026full-timeBoise • California, Idaho • 🇺🇸 United StatesSeniorLead💰 $177,000 - $387,000 per yearWebsite

About the role

Key responsibilities & impact
  • Define and explore advanced package architectures for future memory systems
  • Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
  • Create hands‑on package designs and models for early feasibility analysis
  • Run SI/PI and thermal simulations and translate results into architecture guidance
  • Define package requirements and act as extension architecture and engineering

Requirements

What you’ll need
  • Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
  • 10+ years of hands‑on experience in package design or package‑level simulation
  • Strong experience with package SI modeling and analysis
  • Ability to independently build models and drive conclusions

Benefits

Comp & perks
  • Health insurance
  • 401(k) matching
  • Paid family leave
  • Paid time-off program
  • Paid holidays

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools
package designpackage-level simulationSI modelingPI modelingthermal simulationsarchitecture guidancefeasibility analysistrade-off studiesmodel buildinganalysis
Soft Skills
independent workconclusion driving
Certifications
Bachelor’s degree in EEBachelor’s degree in MEBachelor’s degree in Materials