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About the role
Key responsibilities & impact- Define and explore advanced package architectures for future memory systems
- Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
- Create hands‑on package designs and models for early feasibility analysis
- Run SI/PI and thermal simulations and translate results into architecture guidance
- Define package requirements and act as extension architecture and engineering
Requirements
What you’ll need- Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
- 10+ years of hands‑on experience in package design or package‑level simulation
- Strong experience with package SI modeling and analysis
- Ability to independently build models and drive conclusions
Benefits
Comp & perks- Health insurance
- 401(k) matching
- Paid family leave
- Paid time-off program
- Paid holidays
ATS Keywords
✓ Tailor your resumeApplicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
package designpackage-level simulationSI modelingPI modelingthermal simulationsarchitecture guidancefeasibility analysistrade-off studiesmodel buildinganalysis
Soft Skills
independent workconclusion driving
Certifications
Bachelor’s degree in EEBachelor’s degree in MEBachelor’s degree in Materials
