Package Architect – Advanced Packaging, System Exploration

Eightfold

Package Architect at Micron Technology focusing on advanced packaging and system exploration. Defining architectures for future memory systems with extensive experience in package design and simulation.

Posted 4/21/2026full-timeBoise • California, Idaho • 🇺🇸 United StatesSeniorLead💰 $177,000 - $387,000 per yearWebsite

About the role

Key responsibilities & impact

Define and explore advanced package architectures for future memory systems
Perform package‑level trade‑off studies across SI, PI, thermals, cost, and scalability
Create hands‑on package designs and models for early feasibility analysis
Run SI/PI and thermal simulations and translate results into architecture guidance
Define package requirements and act as extension architecture and engineering

Requirements

What you’ll need

Bachelor’s degree or equivalent practical experience in EE, ME, Materials, or related field
10+ years of hands‑on experience in package design or package‑level simulation
Strong experience with package SI modeling and analysis
Ability to independently build models and drive conclusions

Benefits

Comp & perks

Health insurance
401(k) matching
Paid family leave
Paid time-off program
Paid holidays

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

package designpackage-level simulationSI modelingPI modelingthermal simulationsarchitecture guidancefeasibility analysistrade-off studiesmodel buildinganalysis

Soft Skills

independent workconclusion driving

Certifications

Bachelor’s degree in EEBachelor’s degree in MEBachelor’s degree in Materials