Eightfold

Principal Engineer, Advanced Packaging Process Engineering

Eightfold

full-time

Posted on:

Location Type: Office

Location: Singapore • Singapore

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Job Level

Senior

Tech Stack

Assembly

About the role

  • Developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.
  • Assessing processes by knowledge and skills, taking measurements and interpreting data.
  • Assembly design rules development working side by side with Design teams (Globally).
  • Involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
  • Path finding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies.
  • Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), WSS (Wafer Support System), photo process and Ball Mount is a plus.
  • Hands-on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.
  • Minimum of 3 years of experience in semiconductor manufacturing or related fields.
  • Proven track record in yield management and driving yield improvement initiatives.
  • Flexibility to support operation including shift -based work and periodic weekend coverage based on critical business needs.
  • Deep understanding of semiconductor manufacturing processes, yield analysis, and statistical process control (SPC).
  • Hands-on experience with data analysis tools such as JMP, or equivalent.
  • Strong communication skills, and able to present complex technical data and trends to leadership and non-technical audiences.
  • Proven ability to work with multi-functional teams and influence partners to achieve strategic goals.
  • Strong analytical skills with the ability to troubleshoot and resolve complex technical issues in a high-pressure environment.
  • Ability to manage numerous projects simultaneously and prioritize tasks in a fast-paced environment.
  • Experience working with teams across different geographies and cultures.
Benefits
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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
semiconductor manufacturingyield managementyield improvementstatistical process controldata analysisPackage Assembly processesBumping technologyFlip chip technologyHBM technologyprocess control systems
Soft Skills
strong communication skillsanalytical skillstroubleshootingproject managementprioritizationflexibilityinfluencing partnersworking with multi-functional teamspresentation skillscross-cultural collaboration
Certifications
Bachelor’s degree in Electrical EngineeringMaster’s degree in Electrical EngineeringBachelor’s degree in Materials ScienceMaster’s degree in Materials ScienceBachelor’s degree in PhysicsMaster’s degree in Physics