Eightfold

Lead Engineer – Package Development, Engineering

Eightfold

full-time

Posted on:

Location Type: Office

Location: Singapore • Singapore

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Job Level

Senior

About the role

  • Manage full lifecycle of PDE programs including planning, execution, monitoring, and closure.
  • Define project missions, objectives, key deliverables, and resource requirements.
  • Lead cross-functional teams across TD, HVM, CPI, DRAM, and NPI to ensure timely and quality delivery of strategic initiatives.
  • Develop and implement standardized PMO methodologies, tools, and templates.
  • Own CapEx and OpEx planning, PTM and MOR management, and BOP design systems integration.
  • Ensure compliance with internal governance models and external customer requirements.
  • Align project goals with PDE’s mission to embed analytics and simulation into development workflows.
  • Facilitate stakeholder communication across BU, PDT, TPM, and central engineering teams.
  • Provide regular updates to leadership on project status, risks, and mitigation strategies.
  • Develop and track KPIs for project success, yield reporting, and EOL accountability.
  • Conduct project reviews to assess outcomes and identify lessons learned.
  • Mentor project managers and promote continuous improvement across PMO practices.

Requirements

  • Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical field
  • 8+ years of experience in semiconductor packaging, process integration, or technology development.
  • Proven track record in managing complex, cross-functional projects in a high-tech environment.
  • Strong understanding of packaging flows including hybrid bonding, CoWoS, and chiplet integration.
  • Excellent communication, leadership, and stakeholder management skills.
Benefits
  • Health insurance
  • Professional development opportunities
  • Paid time off
Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools
project managementPDE program managementCapEx planningOpEx planningBOP design systems integrationKPI developmentyield reportingEOL accountabilitypackaging flowstechnology development
Soft Skills
leadershipstakeholder managementcommunicationmentoringcontinuous improvement