Lead Engineer, Package Development
Eightfold
full-time
Posted on:
Location Type: Office
Location: Singapore • Singapore
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Job Level
About the role
- Provide technical leadership and strategic oversight for advanced packaging initiatives.
- Drive technology enablement, yield acceleration, and seamless integration of next-generation packaging solutions.
- Establish governance frameworks and optimize development workflows.
- Ensure compliance with internal governance models and customer technical requirements.
- Align pillar objectives with PDE’s mission and facilitate technical communication across teams.
- Define and monitor KPIs for technology maturity, yield performance, and EOL accountability.
- Conduct technical reviews and mentor engineers.
Requirements
- Bachelor’s or Master’s degree in Engineering, Materials Science, or related technical discipline.
- 8+ years of experience in semiconductor packaging, process integration, or technology development.
- Proven ability to lead complex, cross-functional technical programs in a high-tech environment.
- Deep understanding of advanced packaging flows including hybrid bonding, CoWoS, and chiplet integration.
- Strong technical communication and leadership skills.
Benefits
- Health insurance
- 401(k) matching
- Professional development opportunities
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard Skills & Tools
semiconductor packagingprocess integrationtechnology developmentadvanced packaging flowshybrid bondingCoWoSchiplet integrationKPI monitoringtechnical reviewsdevelopment workflows
Soft Skills
technical leadershipstrategic oversighttechnical communicationmentoringcross-functional collaborationgovernance frameworksyield accelerationcompliance assuranceproblem-solvingteam facilitation
Certifications
Bachelor’s degree in EngineeringMaster’s degree in EngineeringBachelor’s degree in Materials ScienceMaster’s degree in Materials Science