Senior Engineer, APTD Photo/Bumping
Eightfold
full-time
Posted on:
Location Type: Office
Location: Taichung • Taiwan
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About the role
- Responsible for setting the advanced packaging materials roadmap
- Driving materials suppliers to meet roadmap needs
- Leading materials aspects of program execution
- Resolving all materials-package interaction issues
- Improving quality-yield and resolving process/product deviations in short turnaround time
- Driving continuous improvement and handling changes in µ-bump
- Identifying operational excellence opportunities and leading projects for improvement
Requirements
- At least 3 years experience in semiconductor material related industry
- Master degree in Chemistry, Material or related fields, PhD is preferred
- Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
- Demonstrated experience with technical problem-solving skills with multitasking
- Functioning both as individual contributor and as project leader
- Strong communication skills for collaboration cross teams
- Must be flexible in accommodating changing priorities and working hours to support business needs.
Benefits
- Health insurance
- Competitive salary
- Professional development opportunities
- Flexible working hours
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
design of experiment techniquesStatistical Process Controldefect analysisdata analysistechnical problem-solvingmultitasking
Soft skills
strong communicationcollaborationflexibilityleadership
Certifications
Master degree in ChemistryMaster degree in MaterialPhD in ChemistryPhD in Material