Senior Engineer, APTD Bonding / Wafer Thinning
Eightfold
full-time
Posted on:
Location Type: Office
Location: Taichung • Taiwan
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About the role
- Drive improvement in wafer bonding/debonding (WSS) or wafer thinning performance
- Coordinate experiments for technology development and yield improvement
- Assist advanced package technology (chip stacking, 2.5D or 3D) research and development
- Support project on-site execution and make decisions as technical consultant
- Troubleshoot a variety of complex problems and resolve process engineering issues
- Generate internal and external documentation for presentations and technical reports
- Engage in process development projects providing expert contribution in materials characterization.
- Coordinate mechanical characterization and testing for advanced packaging development efforts globally
Requirements
- At least 3 years experience in semiconductor related industry
- Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields
- Experience of wafer bond/debond (WSS) or Si grinding/CMP technologies
- Innovative with independent thinking
- Good team player with high motivation
- Fluent communication in both English and Chinese.
Benefits
- Health insurance
- Retirement plans
- Paid time off
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
wafer bondingwafer debondingwafer thinningchip stacking2.5D technology3D technologymaterials characterizationmechanical characterizationSi grindingCMP technologies
Soft skills
independent thinkingteam playerhigh motivationfluent communication
Certifications
Master's degreePhD