Electromechanical Packaging Engineer

Claros

Electromechanical Packaging Engineer at Claros. Supporting chip scale packaging design and collaborating with engineers to enhance AI powered sustainable solutions.

Posted 6/30/2026full-timeTorrance • California • 🇺🇸 United StatesMid-LevelSenior💰 $150,000 - $200,000 per yearWebsite

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.
Collaborate with substrate layout, ASIC design, and manufacturing engineers.
Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test.

Requirements

What you’ll need

Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.
5+ years’ experience with microelectronics packaging, and/or PCB design
Knowledge of foundry processes and chip scale assembly processes
Understanding of how electrical design requirements impact substrate layout and interconnect selection
Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T
Ability to read and create electrical schematics
Familiarity with tape out processes for wafers and substrate
Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM).
Willingness to learn new concepts and techniques and concepts
Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus
Basic understanding of component level thermal analysis is a plus
Willingness to be in the office in Torrance, CA a minimum of 3 days per week

Benefits

Comp & perks

Career track opportunity with potential for rapid advancement with strong performance as the firm grows
100% employer paid, comprehensive health care including medical, dental, and vision for you and your family.
Paid maternity and paternity for 14 weeks at employees' normal pay.
Unlimited PTO, with management approval.
Opportunities for professional development and continued learning.
Optional 401K, FSA, and equity incentives available.

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills & Tools

Chip Scale Packaging DesignHDI Organic Substrate LayoutMechanical Drawings GenerationGD&TElectrical Design RequirementsDFMThermal AnalysisTape Out Processes

Soft Skills

CollaborationWillingness to Learn

Certifications

BS in Mechanical EngineeringBS in Electrical EngineeringMS or Higher-Level Degree Preferred