Package Design Engineer

Broadcom

IC package-design engineer developing package designs for ASICs in AI, networking, and HPC. Collaborating with a worldwide R&D team for efficiency improvements of complex flip-chip BGA packages.

Posted 6/2/2026full-timeSan Jose • California, Colorado, Texas • 🇺🇸 United StatesSeniorLead💰 $141,300 - $226,000 per yearWebsite

Tech Stack

Tools & technologies

DAC

About the role

Key responsibilities & impact

Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal
Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.
Schedule, prioritize, & track your work across 2+ projects simultaneously
General flip-chip BGA package design & engineering
Project management and customer interface for your design projects
Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.
Physical design (layout) is a foundational responsibility in this role

Requirements

What you’ll need

BSEE or similar field and 12+ years' experience in flip-chip-BGA package design, including high-speed SerDes
MSEE or similar field and 10+ years' work experience
Knowledge of package-level signal integrity and power integrity, to apply to package designs
Cadence APD (allegro package designer) experience is preferred.
Self-management and organization skills
Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

Benefits

Comp & perks

Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time

ATS Keywords

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Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard Skills & Tools

ASIC package designsignal integritypower integrityflip-chip BGA designhigh-speed SerDesprocess developmentautomationdocumentationCadence APDCadence SKILL

Soft Skills

self-managementorganizationproject managementcustomer interfaceefficiency improvement

Certifications

BSEEMSEE