Provide deeper expertise in 2.5D / 3D technology ; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution
Lead in identification, development & qualification; program management with external assembly partners
Lead in memory supplier(s) engagement to define technology and quality requirements
Interface with other technical teams (DI, Pkg Design, Test Dev) etc. as part of Cross Functional Team
Support new design wins, NPI and volume ramps
Develop alternate sourcing & qualification.

Requirements

Master's Degree in Mechanical / Electrical / Electronics Engineering with 6+ years of relevant experience in developing cost effective, high performance (speed, density, pin count, thermal & reliable), single & multi-chip, large, complex, custom & fine pitch flip chip packaging solution with advanced multi-layer ceramic / organic substrates & Interposers; Standard & thermally enhanced fine pitch leaded & BGA wire bond & wafer level packaging solution; or PhD with 10+ years of relevant experience
4~6 years Hands On experience in 2.5D / 3D Development
In-depth Know-how of Advanced Silicon fab, Bump, Interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions
Sound knowledge of & hands on experience in advanced, prevailing and emerging silicon, package & substrate technologies, bumping and assembly processes, design rules, failure analysis tools and techniques, materials and equipment, applicable industry standards, regulations & quality systems
Good team player with project management, analytical, problem-solving and interpersonal skills
Must be self-driven, flexible and agile, result oriented individual
Ability to develop concepts into structured projects, generate new and innovative solutions to complex problems and handle multiple programs concurrently
Hands-on experience of use of modelling (Thermal & Mechanical) & Sub / PCB Design CAD tools (APD, AutoCAD, Solidworks etc ) for design optimization
Sound knowledge of advanced node silicon fabrication, PCB technologies and board assembly processes, applicable industry standards, quality systems and regulations
Communicate extensively with internal and external team members, customers in various global locations and may require travel from time to time.

Benefits

Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
company paid holidays
paid sick leave and vacation time
Paid Family Leave and other leaves of absence

Applicant Tracking System Keywords

Tip: use these terms in your resume and cover letter to boost ATS matches.

Hard skills

2.5D technology3D technologyprogram managementmemory supplier engagementflip chip packagingmulti-layer ceramic substratesBGA wire bondwafer level packagingthermal and mechanical interactionsfailure analysis tools

Soft skills

project managementanalytical skillsproblem-solvinginterpersonal skillsself-drivenflexibleagileresult orientedteam playerinnovative solutions

Certifications

Master's Degree in Mechanical EngineeringMaster's Degree in Electrical EngineeringMaster's Degree in Electronics EngineeringPhD in relevant field