Boeing

Electronics Design and Analysis Engineer

Boeing

full-time

Posted on:

Origin:  • 🇮🇳 India

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Job Level

SeniorLead

Tech Stack

AssemblyCloudFlash

About the role

  • Lead Card Design and development of state-of-the art electronics using DO254 processes and produce necessary documentation
  • Architect and create Hardware design and verification plans, detailed design, requirements decomposition, testing and integration of hardware
  • Setup, review and release Hardware Design Plan, Hardware Validation Plan, Hardware Verification Plan and align them to Plan for Hardware Aspects of Certification
  • Responsible for digital design, timing, worst case circuit analysis, and communications systems
  • Simplify circuits containing flash, processors, FPGAs and memories to explain underlying concepts
  • Develop architecture with circuits involving SERDES, Audio-Video and Intel architectures
  • Develop high speed interface-based circuit designs and work with mechanical teams for thermal analysis and electromechanical packaging
  • Manage component/system level-electronics design and development and selection of components for avionics designs
  • Perform EMI, power integrity and timing analysis and use tools such as Hyperlynx SI and Mentor eCAD suite
  • Support Manufacturing of Electronic Assemblies including manufacturing readiness, rapid prototyping, DFM/DFMA and test considerations
  • Provide inputs and accept designs for electromechanical packaging; review thermal, structural, interference, CG, material and human factor analysis outputs
  • Collaborate with global Boeing India Engineering teams and work both autonomously and in cross-functional teams

Requirements

  • Bachelor's in engineering degree or higher (Bachelor, Master or Doctorate of Science degree) in engineering, computer science, mathematics, physics or chemistry
  • 10 or more years' experience in Electrical Engineering (Bachelor +10 years; Master's +9 years; PhD with experience)
  • Experience with digital board design
  • Experience with DO-254 processes and associated documentation
  • Ability to architect and create Hardware design and verification plans, Hardware Validation Plan, Hardware Verification Plan
  • Experience with digital design, timing, worst case circuit analysis, and communications systems
  • Experience simplifying circuits containing flash, processors, FPGAs and memories
  • Experience with SERDES, Audio-Video and Intel architectures
  • Experience developing high speed interface-based circuit designs and thermal/electromechanical packaging collaboration
  • EMI Analysis experience; good understanding of grounding and shielding concepts, chassis design
  • Experience managing component/system level-electronics design and development
  • Design and Testing experience of DDR3/4, PCIe gen3, USB3, LPDDR, MIPI, SATA, Ethernet and I2C/SPI/UART buses
  • Component selection experience for avionics electronics (DDR, memory, storage media flash, ethernet controllers)
  • Good understanding of ARINC 429, ARINC 818 and MIL 1553
  • Experience with Power Integrity analysis, Hyperlynx SI, Timing Analysis
  • Experience with Mentor suite of eCAD tools
  • Experience with Manufacturing of Electronic Assemblies (manufacturing readiness assessments, Rapid Prototyping, dfmat, electronics manufacturing)
  • Preferred: knowledge of high reliability system designs (redundancy, single event failures, safety flow analysis)
  • Experience with development and certification to DO-160, DO-254, MIL-STD 810
  • Experience giving inputs and accepting designs for electromechanical packaging and reviewing thermal, structural, interference, CG, material, human factor analysis outputs
  • Basic understanding of electronic manufacturing processes including PCB fabrication, component assembly, ICT, FCT, EOL
  • Visa Sponsorship: Employer will not sponsor applicants for employment visa status
  • Security Clearance: This position does not require a Security Clearance
  • Language Requirements: Not Applicable