Profit Center Manager, Printed Circuit Board Assembly

ASSA ABLOY Opening Solutions

Profit Center Manager for Printed Circuit Board Assembly at Sargent Manufacturing. Responsible for tooling, processes, and quality improvements in PCB production.

Posted 7/24/2026full-timeNew Haven • Connecticut • 🇺🇸 United StatesMid-LevelSeniorWebsite

Core Competencies

Role fit

Core Competencies

Use this summary to align your resume positioning with the role.

Demonstrates expertise in Surface Mount Technology (SMT) processes and development, with a strong focus on improving process yield, quality, and efficiency in PCB assembly. Proficient in leading New Product Introduction (NPI) activities and optimizing manufacturing processes through effective tooling and documentation.

Highest-signal resume keywords

Surface Mount Technology (SMT) DevelopmentProcess Failure Mode and Effects Analysis (PFMEA)Design of Experiments (DOE)Lean ManufacturingNew Product Introduction (NPI)

ATS Keywords

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Applicant Tracking System Keywords

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Hard Skills

Surface Mount Technology (SMT) ProcessesProcess DevelopmentRoot Cause AnalysisBill of Materials (BOM) ConfigurationStencil DesignSolder Paste CharacteristicsSolder Reflow ProcessesManufacturing Process OptimizationEquipment Programming and TroubleshootingQuality Improvement

Tools & Technologies

Microsoft Office SuiteSolder Paste Inspection (SPI)Automated Optical Inspection (AOI)Reflow OvensPlacement Equipment

Industry Keywords

Printed Circuit Board Assemblies (PCBA)Manufacturing EngineeringIndustrial EngineeringAssembly OperationsProcess YieldCycle TimeInventory AccuracyDelivery

Tech Stack

Tools & technologies

Assembly

About the role

Key responsibilities & impact

Develop and implement tooling, processes, documentation, and instructions for PCBAs.
Conduct Design of Experiments (DOE), Process Failure Mode and Effects Analysis (PFMEA), and other methodologies to improve processes and quality.
Configure Bill of Materials (BOMs) and routings for Printed Circuit Board Assemblies (PCBA)/systems in accordance with product structures, standards, and internal procedures.
Demonstrate strong knowledge of stencil design, solder paste characteristics, stencil printing, pick and place, and solder reflow processes.
Determine root causes of PCBA defects and implement necessary changes.
Continuously review assembly operations for accuracy, proper manufacturing methods, and optimization of manufacturing processes.
Participate in and lead New Product Introduction (NPI) activities for all electronic assemblies.
Order equipment, tools, and instruments for new processes.

Requirements

What you’ll need

Bachelor of Science in Manufacturing Engineering, Industrial Engineering or related field of study.
Must have a minimum of 5 years of Surface Mount Technology (SMT) or PCBA development experience.
Lean Manufacturing experience is required.
Strong background in Surface Mount Technology (SMT) processes and process development, with the ability to serve as a technical expert.
Proven ability to lead improvements in process yield, quality, cycle time, inventory accuracy, and delivery.
Proficiency in Surface Mount Technology (SMT) equipment programming and troubleshooting, including placement equipment, Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), printing, and reflow ovens.
Proficient in Microsoft Office Suite (Word, Excel, PowerPoint, Access, Outlook).

Benefits

Comp & perks

Bonus eligible.
Medical, Dental, Vision along with various plan options to choose from.
401K w. employer match and Roth IRA contribution.
Corporate Discounts.