Manager, OSAT Assembly Engineering
Qorvo, Inc.
full-time
Posted on:
Location Type: Office
Location: Singapore • 🇸🇬 Singapore
Visit company websiteJob Level
SeniorLead
Tech Stack
Assembly
About the role
- Manage Qorvo products for smooth ATI/NPI execution and HVM engineering
- Early engagement & execution of a Packaging Technology development working with Qorvo PKG team & OSAT partner on-site aligned with cooperate roadmap to meet future Qorvo Business Unit needs
- Manage multiple projects for package development from risk assessment, process /BOM establishment, qualification
- Utilize program management methodology to plan, execute and monitor complex process and/or product development projects
- Lead and Manage OSAT New Technology and New Product Introduction, Qualification, HVM, in a timely and flawless manner
- Strong problem-solving skill in Assembly engineering and leadership working with OSATs partner & cross functional team in Qorvo
- Strong communication, presentation skills, ability to excel in a dynamic collaborative team environment including working directly with the R&D, Quality and Product line is necessary
- Think and act professionally in the consistent Manner as a Qorvo engineering representative of on-site OSAT
- Manage/Coach QI’s engineering resource from the daily work
- Able to implement Continuous process improvement and innovation Value Engineering projects
- Manage other work centers as well upon requested
- Report to Engineering Director in Singapore
Requirements
- Bachelor’s or master’s degree in mechanical engineering, Material Science engineering or a related field
- Minimum 10 years in semiconductor packaging or assembly engineering industry
- Good attitude, detail-orientated, proactive, quick learner and able to work effectively in a fast-paced environment
- Proven strong interpersonal and communication skills with willingness to take accountability
- Ability to address internal and external customer complaints and do multi-tasking
- Ability to lead cross-functional teams and drive supplier performance
- Language English fluency in addition to Chinese language working with OSATs & Customers who are chinese speaking in countries like China & Taiwan
Benefits
- Good communication skill with open minded to learn semiconductor area: Bumping, DPS and Assembly process
Applicant Tracking System Keywords
Tip: use these terms in your resume and cover letter to boost ATS matches.
Hard skills
program managementrisk assessmentprocess establishmentBOM establishmentqualificationcontinuous process improvementvalue engineeringassembly engineeringsemiconductor packagingproject management
Soft skills
problem-solvingcommunicationpresentationinterpersonal skillsaccountabilitydetail-orientedproactivequick learnermulti-taskingleadership
Certifications
Bachelor’s degree in mechanical engineeringMaster’s degree in mechanical engineeringBachelor’s degree in Material Science engineeringMaster’s degree in Material Science engineering